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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 15
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
10,440
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TWISTED FIN TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 0.942" (23.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,117
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB TIN
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- | Board Level, Vertical | - | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,250
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,540
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 POWER W/PINS BK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
8,223
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 BLACK .87"
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- | Top Mount | Aluminum | Rhombus | 1.540" (39.12mm) | - | 1.125" (28.57mm) OD | Bolt On | TO-3 | 0.870" (22.10mm) | 2.5W @ 40°C | 12.50°C/W | Black Anodized | ||
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Ohmite |
342
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 BLACK
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E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.378" (35.00mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,113
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 50.8MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 8.0W @ 60°C | 7.50°C/W | Black Anodized | ||
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Ohmite |
100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220
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E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.378" (35.00mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 9.40°C/W | Degreased | ||
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Aavid, Thermal Division of Boyd Corporation |
200
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 9W H=2.0" BLK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | Bolt On | TO-220, TO-202 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 CLIP-ON .58" BK
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- | Board Level | Aluminum | Rectangular | 0.800" (20.32mm) | 0.577" (14.66mm) | - | Clip | TO-202 | 0.250" (6.35mm) | 1.0W @ 30°C | 28.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Top Mount | - | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.942" (23.92mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | - | Black Anodized |
