- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 13
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
10,440
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TWISTED FIN TO-220
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.942" (23.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
4,117
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB TIN
|
- | Board Level, Vertical | - | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
4,540
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 POWER W/PINS BK
|
- | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||||
Ohmite |
342
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 BLACK
|
E | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.378" (35.00mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
2,113
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 50.8MM
|
- | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 8.0W @ 60°C | 7.50°C/W | Black Anodized | ||||
Ohmite |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220
|
E | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.378" (35.00mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 9.40°C/W | Degreased | ||||
Aavid, Thermal Division of Boyd Corporation |
200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 9W H=2.0" BLK
|
- | Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On | TO-220, TO-202 | 0.500" (12.70mm) | 5.0W @ 40°C | 7.50°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | - | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 14.00°C/W | Tin | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | 0.942" (23.92mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | - | Black Anodized |