Descubre los productos 13
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
593002B03400G
Aavid, Thermal Division of Boyd Corporation
10,440
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TWISTED FIN TO-220
- Board Level, Vertical Aluminum 1.180" (29.97mm) 0.942" (23.93mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 1.0W @ 20°C 13.40°C/W Black Anodized
563002D00000G
Aavid, Thermal Division of Boyd Corporation
4,117
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB TIN
- Board Level, Vertical - 1.180" (29.97mm) 1.000" (25.40mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 1.0W @ 20°C 13.00°C/W Tin
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,250
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
- Top Mount Copper 0.500" (12.70mm) 1.220" (30.99mm) SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,255
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
- Top Mount Copper 0.500" (12.70mm) 1.220" (30.99mm) SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,255
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
- Top Mount Copper 0.500" (12.70mm) 1.220" (30.99mm) SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
531202B02500G
Aavid, Thermal Division of Boyd Corporation
4,540
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 POWER W/PINS BK
- Board Level, Vertical Aluminum 2.000" (50.80mm) 1.375" (34.93mm) Bolt On and PC Pin TO-220, TO-202 0.500" (12.70mm) 5.0W @ 40°C 7.50°C/W Black Anodized
EA-T220-51E
Ohmite
342
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-220 BLACK
E Board Level, Vertical Aluminum 2.000" (50.80mm) 1.378" (35.00mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 5.0W @ 40°C 7.50°C/W Black Anodized
531202B02100G
Aavid, Thermal Division of Boyd Corporation
2,113
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN 50.8MM
- Board Level, Vertical Aluminum 2.000" (50.80mm) 1.375" (34.93mm) Bolt On and PC Pin TO-220, TO-202 0.500" (12.70mm) 8.0W @ 60°C 7.50°C/W Black Anodized
EV-T220-51E
Ohmite
100
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-220
E Board Level, Vertical Aluminum 2.000" (50.80mm) 1.378" (35.00mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 5.0W @ 40°C 9.40°C/W Degreased
531202B00000G
Aavid, Thermal Division of Boyd Corporation
200
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 9W H=2.0" BLK
- Board Level, Vertical Aluminum 2.000" (50.80mm) 1.375" (34.93mm) Bolt On TO-220, TO-202 0.500" (12.70mm) 5.0W @ 40°C 7.50°C/W Black Anodized
593002B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical Aluminum 1.180" (29.97mm) 1.000" (25.40mm) Bolt On TO-220 0.500" (12.70mm) 1.0W @ 20°C 13.40°C/W Black Anodized
573400D00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Top Mount - 0.500" (12.70mm) 1.220" (30.99mm) SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
825402B03400
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 25.4X12.7X30MM
- Board Level, Vertical Aluminum 0.942" (23.92mm) 1.000" (25.40mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 1.0W @ 20°C - Black Anodized