- Series：
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- Length：
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- Width：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 11,371
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
24,011
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-220 .375" COMPACT
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.375" (9.52mm) | 3.0W @ 80°C | 12.00°C/W @ 200 LFM | 25.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
17,317
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-220 .500" COMPACT
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.500" (12.70mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 24.40°C/W | Black Anodized | ||
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ASSMANN WSW Components |
6,712
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Top Mount | Aluminum | 0.334" (8.50mm) | 0.250" (6.35mm) | - | Press Fit | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
14,552
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PWR CLR 1.45"10W
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- | Board Level | Aluminum | 1.450" (36.83mm) | 0.780" (19.81mm) | - | Bolt On | TO-220 (Dual) | 0.850" (21.60mm) | 4.0W @ 40°C | 5.00°C/W @ 200 LFM | 6.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
42,175
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK VERT PLUG-IN TO-220
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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ASSMANN WSW Components |
18,400
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
18,715
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
18,715
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Top Mount | Copper | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,250
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
18,047
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLACK .19"
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- | Top Mount | Aluminum | 0.250" (6.35mm) | 0.731" (18.57mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
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3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
13,880
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 5W BLK
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
10,440
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TWISTED FIN TO-220
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- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.942" (23.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
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3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,627
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .5" TO-220
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- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and Board Locks | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,015
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS 1.5"TALL
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- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized |
