- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 11
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
6,071
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS 1.5"TALL
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- | Board Level, Vertical | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.500" (38.10mm) | 3.00°C/W @ 200 LFM | 3.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
3,120
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 W/PINS 1.5"TALL
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- | Board Level, Vertical | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
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Ohmite |
1,640
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 1.5"
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F | Board Level, Vertical | 1.500" (38.10mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 0.984" (25.00mm) | 1.50°C/W @ 600 LFM | 3.80°C/W | ||
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Ohmite |
3,241
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 2.5"
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F | Board Level, Vertical | 2.500" (63.50mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-220 | 0.984" (25.00mm) | 2.00°C/W @ 300 LFM | 3.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
1,729
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN/CLIP
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- | Board Level, Vertical | 1.500" (38.10mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-220 (Dual) | 1.000" (25.40mm) | 3.00°C/W @ 200 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
135
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 50.8MM
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- | Board Level, Vertical | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 2.00°C/W @ 300 LFM | 4.80°C/W | ||
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Ohmite |
44
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK HORIZONTAL
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VM | Board Level | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 0.984" (25.00mm) | 0.60°C/W @ 600 LFM | - | ||
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Ohmite |
29
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK UNIVERSAL
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VM | Board Level | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 0.984" (25.00mm) | 0.60°C/W @ 600 LFM | - | ||
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Ohmite |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERTICAL
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VM | Board Level, Vertical | 1.520" (38.61mm) | 2.362" (60.00mm) | Solderable Feet | TO-220, TO-247 | 0.984" (25.00mm) | 0.60°C/W @ 600 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X38.1MM
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- | Board Level, Vertical | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.000" (25.40mm) | 1.50°C/W @ 700 LFM | - |
