- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
2,113
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 50.8MM
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2.000" (50.80mm) | Bolt On and PC Pin | TO-220, TO-202 | 4.00°C/W @ 600 LFM | 7.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.500" (63.50mm) | Bolt On and PC Pin | TO-218, TO-247 | 4.00°C/W @ 200 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.500" (63.50mm) | Bolt On and PC Pin | TO-220 | 4.00°C/W @ 200 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.500" (63.50mm) | Clip and PC Pin | TO-220 | 2.00°C/W @ 800 LFM | 8.00°C/W |
