- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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CUI Inc. |
4,921
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.6W ALUMINUM
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0.375" (9.53mm) | 0.900" (22.86mm) | Clip | 0.740" (18.79mm) | 6.32°C/W @ 200 LFM | ||
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CUI Inc. |
958
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.6W ALUMINUM
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0.520" (13.21mm) | 0.250" (6.35mm) | PC Pin | 0.748" (19.00mm) | 10.68°C/W @ 200 LFM |
