- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
2,737
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-247 TAB
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- | Board Level, Vertical | Rectangular, Fins | 1.640" (41.66mm) | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 8.60°C/W | ||
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Wakefield-Vette |
4,378
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | ||
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Advanced Thermal Solutions Inc. |
1,495
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-218 W/TAB
|
- | Board Level, Vertical | Rectangular, Fins | 1.622" (41.20mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.500" (12.70mm) | - | 6.30°C/W @ 200 LFM | 8.60°C/W | |||
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Wakefield-Vette |
562
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.4"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.400" (10.16mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | - | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-218/TO-247
|
- | Board Level, Vertical | Rectangular, Fins | 1.640" (41.66mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.500" (12.70mm) | - | 6.30°C/W @ 200 LFM | 8.60°C/W | |||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - |
