- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
4,378
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
Thermal Tape, Adhesive (Not Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
562
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.4"
|
Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | ||
|
|
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
Thermal Tape, Adhesive (Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM |
