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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 261
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
25,551
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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- | Top Mount | Aluminum | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | 31.00°C/W | Black Anodized | ||
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Wakefield-Vette |
17,584
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Top Mount | Aluminum | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,813
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
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624 | Top Mount | Aluminum | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
2,632
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
|
655 | Top Mount | Aluminum | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,845
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,350
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Adhesive | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,941
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
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Wakefield-Vette |
2,805
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
3,997
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE .91"SQ
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BDN | Top Mount | Aluminum | 0.910" (23.11mm) | 0.910" (23.11mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | Black Anodized | ||
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Wakefield-Vette |
2,779
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
7,117
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 27.9MM SQ W/ADH BLK
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658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
2,354
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Top Mount | Aluminum | 1.110" (28.19mm) | 1.110" (28.19mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,329
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 12W H=1.25" BLK
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- | Board Level | Aluminum | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | 5.00°C/W | Black Anodized | ||
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Wakefield-Vette |
1,155
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X23MM PIN
|
910 | Top Mount | Aluminum | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,619
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 27MM X 27MM X 24.5MM
|
- | Top Mount | Aluminum | 1.063" (27.00mm) | 1.063" (27.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 4.50°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
1,372
|
3 dias |
-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 31X31X14.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 2.10°C/W @ 200 LFM | - | Black Anodized | |||
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Apex Microtechnology |
381
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 4.5C/W
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Apex Precision Power | Board Level | Aluminum | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.50°C/W | Black Anodized | ||
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Wakefield-Vette |
3,457
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK
|
658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
3,025
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,176
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Top Mount | Aluminum | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized |
