- Series：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Sunon Fans |
367
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X20MM W/ADH
|
- | Thermal Tape, Adhesive (Included) | - | 0.790" (20.00mm) | - | - | - | ||
|
|
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Wakefield-Vette |
134
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK 35X35X23MM PIN
|
908 | Clip | BGA | 0.892" (22.65mm) | 2.10°C/W @ 200 LFM | 8.80°C/W | Black Anodized | ||
|
|
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Wakefield-Vette |
191
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
|
908 | Clip | BGA | 0.457" (11.60mm) | 3.10°C/W @ 200 LFM | 11.10°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
183
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 11.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
119
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X9.5MM
|
fanSINK, maxiGRIP | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 2.60°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 14.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 5.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
26
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 4.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
76
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 24.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 3.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
91
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X14.5MM
|
fanSINK, maxiGRIP | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 1.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
80
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X19.5MM
|
fanSINK, maxiGRIP | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 1.60°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X24.5MM
|
fanSINK, maxiGRIP | Clip, Thermal Material | BGA | 0.964" (24.50mm) | 1.50°C/W @ 200 LFM | - | Black Anodized | |||
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|
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR BGAS FIN HGT .45"
|
630 | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 4.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR BGA 35MM
|
630 | Thermal Tape, Adhesive (Not Included) | BGA | 0.598" (15.20mm) | 3.00°C/W @ 350 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR BGAS FIN HGT .45"
|
630 | Adhesive | BGA | 0.450" (11.43mm) | 4.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X9.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | 11.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X14.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | 5.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X19.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | 4.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X24.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | 3.10°C/W @ 200 LFM | - | Black Anodized |
