- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
2,737
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-247 TAB
|
- | Board Level, Vertical | Rectangular, Fins | 1.640" (41.66mm) | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 6.0W @ 50°C | 8.60°C/W | ||
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Wakefield-Vette |
562
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.4"
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628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.400" (10.16mm) | 2.5W @ 30°C | - |
