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- Condiciones seleccionadas:
Descubre los productos 55
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
17,584
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Top Mount | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,876
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1.25W H=.25" BLK
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- | Top Mount | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 1.0W @ 60°C | 25.00°C/W @ 200 LFM | 54.00°C/W | Black Anodized | ||
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Wakefield-Vette |
4,845
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | - | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,350
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Adhesive | BGA | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
1,686
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
3,861
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
475
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
199
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
657
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
8,455
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB .25
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On and PC Pin | TO-220 | 1.5W @ 50°C | 16.00°C/W @ 200 LFM | 32.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,307
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT MNT W/TABS
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.250" (31.75mm) | 0.874" (22.20mm) | - | Bolt On and PC Pin | TO-220 | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 22.00°C/W | Black Anodized | ||
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Wakefield-Vette |
3,457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,468
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1W H=.25"BLK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.305" (7.75mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.6W @ 40°C | 35.00°C/W @ 200 LFM | 63.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
5,706
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 STAGGERED FIN
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.210" (30.73mm) | 0.875" (22.22mm) | - | Bolt On and PC Pin | TO-220 | 2.0W @ 40°C | 6.00°C/W @ 400 LFM | 16.70°C/W | Black Anodized | ||
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Wakefield-Vette |
839
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
642
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
1,003
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 2W BLK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 1.4W @ 70°C | 35.00°C/W @ 200 LFM | 56.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
1,660
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 19.05X13.21MM
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | - | - | 28.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,683
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | - | 15.80°C/W @ 200 LFM | 32.00°C/W | Black Anodized | |||
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ASSMANN WSW Components |
2,266
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | - | - | 32.00°C/W | Black Anodized |
