- Length：
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- Width：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
CTS Thermal Management Products |
1,686
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.10°C/W @ 200 LFM | ||
|
|
|
CTS Thermal Management Products |
199
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
3,457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
CTS Thermal Management Products |
168
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 4.40°C/W @ 200 LFM |
