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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
1,723
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220/TOP-3/SOT-32
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.359" (34.50mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.492" (12.50mm) | - | - | 5.00°C/W | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL BLACK
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- | Board Level | Aluminum | Rectangular, Angled Fins | 1.772" (45.00mm) | Bolt On | TO-220 | 0.984" (25.00mm) | - | 4.80°C/W @ 200 LFM | 7.20°C/W | |||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.359" (34.50mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 7.3W @ 75°C | 5.77°C/W @ 200 LFM | 10.27°C/W | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.378" (35.00mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 7.4W @ 75°C | 3.94°C/W @ 200 LFM | 10.14°C/W |
