- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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Wakefield-Vette |
5,813
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
|
624 | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | ||
|
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Advanced Thermal Solutions Inc. |
994
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB
|
- | Board Level, Vertical | Rectangular, Fins | 0.945" (24.00mm) | 0.866" (22.00mm) | Clip and Board Mounts | TO-220 | 0.433" (11.00mm) | 17.30°C/W | |||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/OUT ADH
|
624 | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ
|
624 | Top Mount | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - |
