- Series：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 2,065
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Advanced Thermal Solutions Inc. |
301
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
FULL BRICK HEATSINK 117X61X22.9M
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maxiFLOW | Rectangular, Angled Fins | 4.598" (116.80mm) | Bolt On | Full Brick DC/DC Converter | 0.902" (22.90mm) | 1.80°C/W @ 200 LFM | Gold Anodized | |||
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Advanced Thermal Solutions Inc. |
171
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 7.31°C/W @ 100 LFM | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.94°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
61
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 57.9X60.96X11.43MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.56°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 10.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.56°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
73
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 7.31°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 10.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
91
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.94°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
89
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 7.31°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
96
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.94°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
96
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 10.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.94°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.56°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 7.31°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.56°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM T766
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 10.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.93°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.55°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM FP
|
pushPIN | Rectangular, Fins | 2.280" (57.90mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.98°C/W @ 100 LFM | Blue Anodized |
