Fabricante:
Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Material Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
321527B00000G
Aavid, Thermal Division of Boyd Corporation
488
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-5 2W BLK
- Aluminum Threaded Coupling TO-5, TO-39 0.290" (7.37mm) 0.5W @ 20°C 20.00°C/W @ 300 LFM 35.20°C/W Black Anodized
TXBF032025B
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
THERMAL LINK PRESSON TO-5
Fan Top Beryllium Copper Press Fit TO-5 0.250" (6.35mm) - - 81.10°C/W Black Cadmium
TXBF-032-025U
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
THERMAL LINK PRESSON TO-5
Fan Top Beryllium Copper Press Fit TO-5 0.250" (6.35mm) - - 81.10°C/W -