Fabricante:
Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Shape Length Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
6225B-MTG
Aavid, Thermal Division of Boyd Corporation
2,278
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB BLACK
- Board Level, Vertical Aluminum Rectangular, Fins 1.070" (27.18mm) Bolt On and PC Pin TO-220 0.315" (8.00mm) 2.0W @ 40°C 3.00°C/W @ 700 LFM 15.00°C/W
WAVE-26-12
Wakefield-Vette
1,000
3 dias
-
MOQ: 1  MPQ: 1
ANCHOR HEATSINK 26X26X12MM
Wave 2x Board Level Aluminum Alloy Square, Angled Fins 1.024" (26.00mm) Clip BGA 0.472" (12.00mm) - 5.21°C/W @ 200 LFM -