- Series:
-
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Condiciones seleccionadas:
Descubre los productos 2
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
2,278
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.070" (27.18mm) | Bolt On and PC Pin | TO-220 | 0.315" (8.00mm) | 2.0W @ 40°C | 3.00°C/W @ 700 LFM | 15.00°C/W | ||||
Wakefield-Vette |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 26X26X12MM
|
Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.024" (26.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 5.21°C/W @ 200 LFM | - |