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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 60°C | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | Bolt On | TO-66 | 0.750" (19.05mm) | 6.0W @ 60°C | 9.60°C/W | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X50.8MM
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Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 1.5W @ 20°C | - |
