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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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ASSMANN WSW Components |
1,591
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 19.05X13.21MM
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
5,025
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 19X12.8MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
1,201
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ANOD ALUM TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | PC Pin | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | Black Anodized | ||
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ASSMANN WSW Components |
1,214
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.410" (35.81mm) | 0.878" (22.30mm) | - | Bolt On and Board Mounts | TO-220 | 0.252" (6.40mm) | - | - | Tin | ||
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ASSMANN WSW Components |
1,000
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 0.712" (18.08mm) | 1.000" (25.40mm) | - | Bolt On | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
974
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
685
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.410" (35.81mm) | 0.878" (22.30mm) | - | Bolt On and Board Mounts | TO-220 | 0.252" (6.40mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
479
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.787" (20.00mm) | 0.945" (24.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.272" (6.90mm) | - | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
971
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 2.283" (58.00mm) | 2.047" (52.00mm) | - | Bolt On | TO-220 | 0.059" (1.50mm) | - | 12.20°C/W @ 200 LFM | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
32
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X13.9X25MM
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- | Top Mount | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | 0.547" (13.89mm) | - | Adhesive | - | 0.984" (25.00mm) | - | 11.50°C/W @ 200 LFM | Degreased | ||
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American Technical Ceramics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
835
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
835
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||
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American Technical Ceramics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
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American Technical Ceramics |
990
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
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American Technical Ceramics |
990
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On | TO-202 | 0.375" (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | Black Anodized |
