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- Condiciones seleccionadas:
Descubre los productos 13
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
11,297
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW HEIGHT BLK
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274 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.375" (9.52mm) | 2.0W @ 56°C | 28.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
29,991
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT MNT .75"
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.860" (21.84mm) | - | Clip | TO-220 | 0.395" (10.03mm) | 3.0W @ 60°C | 21.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
3,384
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB .375"
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 1.0W @ 30°C | 25.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
10,420
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO220 VER MNT W/TAB.75"
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.810" (20.57mm) | - | Clip and PC Pin | TO-220 | 0.390" (9.91mm) | 3.0W @ 60°C | 21.20°C/W | Black Anodized | ||
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Wakefield-Vette |
3,636
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ H=.45" BLK
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 21MM
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- | Board Level | Copper | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | - | Clip and Board Locks | TO-220 | 0.515" (13.08mm) | 1.0W @ 30°C | 20.30°C/W | Tin | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.01"SQ
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BDN | Top Mount | Aluminum | Square, Pin Fins | 1.010" (25.65mm) | 1.010" (25.65mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 26.40°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK
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231 | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.690" (17.53mm) | 0.835" (21.21mm) | - | Bolt On and PC Pin | TO-220 | 0.400" (10.16mm) | 2.0W @ 45°C | - | Pre-Black Anodized | |||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT BLK
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231 | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.690" (17.53mm) | 0.835" (21.21mm) | - | Bolt On and Board Mounts | TO-220 | 0.400" (10.16mm) | 2.0W @ 45°C | - | Black Anodized | |||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK WITH THERMAL TAPE
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642 | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Adhesive | BGA | 0.450" (11.43mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD | Thermal Tape, Adhesive (Not Included) | BGA | - | 1.5W @ 40°C | - | Black Anodized | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22X28MM
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.100" (27.94mm) | 0.866" (22.00mm) | - | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 40°C | - | Tin |
