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- Condiciones seleccionadas:
Descubre los productos 112,204
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
7,117
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 27.9MM SQ W/ADH BLK
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
2,100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR VERT BLACK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 1.150" (29.21mm) | - | Bolt On | TO-220 | 0.460" (11.68mm) | 3.0W @ 40°C | - | 15.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,336
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN/CLIP
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | 5.00°C/W | Black Anodized | ||
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Ohmite |
8,370
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AND CLIP FOR TO-247 BLK
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W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | 0.921" (23.40mm) | - | Clip and PC Pin | TO-247 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | 7.00°C/W | Black Anodized | ||
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CTS Thermal Management Products |
2,354
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Top Mount | Aluminum | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
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CTS Thermal Management Products |
1,597
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR DUAL BLACK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 2.000" (50.80mm) | - | Bolt On | TO-220 | 0.553" (14.05mm) | 6.0W @ 25°C | - | 4.70°C/W | Black Anodized | ||
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CTS Thermal Management Products |
1,799
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK PWR DUAL BLACK TO-220
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7 | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.150" (29.21mm) | - | Bolt On | TO-220 | 0.460" (11.68mm) | 9.0W @ 60°C | - | 3.10°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,117
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB TIN
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- | Board Level, Vertical | - | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,063
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 1.000" (25.40mm) | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | 2.70°C/W | Black Anodized | ||
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CTS Thermal Management Products |
2,562
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR W/PINS BLACK TO-220
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7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | - | 7.00°C/W | Black Anodized | ||
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Wakefield-Vette |
5,421
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DC/DC HALF BRICK VERT
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528 | Board Level | Aluminum | Rectangular, Fins | 2.402" (61.00mm) | 2.280" (57.91mm) | - | Bolt On | Half Brick DC/DC Converter | 0.450" (11.43mm) | 7.0W @ 60°C | 3.20°C/W @ 300 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,207
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 50X50X6MM XCUT CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | - | 15.83°C/W @ 100 LFM | - | Blue Anodized | |||
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Wakefield-Vette |
3,786
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DC/DC HALF BRICK VERT
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518 | Board Level | Aluminum | Rectangular, Fins | 2.402" (61.00mm) | 2.280" (57.91mm) | - | Bolt On | Half Brick DC/DC Converter | 0.950" (24.13mm) | 11.0W @ 60°C | 2.00°C/W @ 300 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,329
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-3 12W H=1.25" BLK
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- | Board Level | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | 5.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,488
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK FOR TI MOD #TPA3130D
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Advanced Thermal Solutions Inc. |
4,769
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | |||
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CTS Thermal Management Products |
1,686
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,973
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 26.20°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
860
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 17MM X 17MM X 9.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 24.30°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
998
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 29.50°C/W @ 200 LFM | - | Black Anodized |
