- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
113
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.71"SQ
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BDN | Top Mount | Square, Pin Fins | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Black Anodized | ||
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Ohmite |
92
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DUAL FOR TO-220/247 BLK
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W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
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Ohmite |
27
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DUAL FOR TO-220/247
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 6.00°C/W | Degreased |
