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- Condiciones seleccionadas:
Descubre los productos 12,446
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
3,956
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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|
|
CTS Thermal Management Products |
475
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
1,356
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
368
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,675
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 1.772" (45.00mm) | Bolt On | TO-220 | 0.079" (2.00mm) | - | 11.00°C/W @ 200 LFM | 23.00°C/W | - | |||
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t-Global Technology |
1,228
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | - | ||
|
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Advanced Thermal Solutions Inc. |
195
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X10MM R-TAB FP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 26.36°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
167
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 30X30X15MM R-TAB CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 10.07°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
151
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X25MM L-TAB CP
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pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 5.52°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
186
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X30MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | - | 4.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
248
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X30MM L-TAB FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | - | 8.57°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,239
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 14.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
CTS Thermal Management Products |
168
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
115
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 3.70°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
2,838
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Angled Fins | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | 7.00°C/W @ 200 LFM | 13.40°C/W | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
121
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X20MM L-TAB FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | - | 14.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
206
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 6.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
372
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
2,773
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218/TO-202/TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | Bolt On | TO-220, TO-202 | 0.500" (12.70mm) | - | 10.10°C/W @ 200 LFM | 22.00°C/W | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
636
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 4.40°C/W @ 200 LFM | - | Blue Anodized |
