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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
2,354
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 20.90°C/W | ||
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Wakefield-Vette |
6,905
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW HEIGHT BLK
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273 | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On | TO-220, TO-218 | 0.375" (9.52mm) | 2.0W @ 49°C | 24.50°C/W |
