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- Material:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Natural:
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- Condiciones seleccionadas:
Descubre los productos 2
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 45X44X22.5MM
|
Top Mount | Copper | 1.772" (45.00mm) | Push Pin | BGA | 0.886" (22.50mm) | 1.65°C/W @ 200 LFM | 8.00°C/W | AavSHIELD 3C | ||||
Advanced Thermal Solutions Inc. |
991
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Board Level | Aluminum | 1.732" (44.00mm) | Bolt On | TO-220 | 0.059" (1.50mm) | 13.00°C/W @ 200 LFM | 22.00°C/W | Black Anodized |