Fabricante:
Material:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Material Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
342942
Aavid, Thermal Division of Boyd Corporation
60
3 dias
-
MOQ: 1  MPQ: 1
COPPER HEATSINK 45X44X22.5MM
Top Mount Copper 1.772" (45.00mm) Push Pin BGA 0.886" (22.50mm) 1.65°C/W @ 200 LFM 8.00°C/W AavSHIELD 3C
ATS-PCBT1098
Advanced Thermal Solutions Inc.
991
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220
Board Level Aluminum 1.732" (44.00mm) Bolt On TO-220 0.059" (1.50mm) 13.00°C/W @ 200 LFM 22.00°C/W Black Anodized