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- Length：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,925
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-18 1W BLK
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Top Mount | Cylindrical | - | - | 0.180" (4.57mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-18 | 0.6W @ 60°C | 30.00°C/W @ 500 LFM | 100.00°C/W | ||
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GE Critical Power |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 2.39L X.235"H EXTRUSION
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Board Level | Rectangular, Fins | 2.390" (60.71mm) | 2.280" (57.91mm) | - | Bolt On | - | - | - | - |
