- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Ohmite |
284
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 218 247 2.5"
|
R | Board Level, Vertical | 1.654" (42.00mm) | 0.985" (25.00mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 4.0W @ 20°C | 1.00°C/W @ 200 LFM | 3.10°C/W | ||
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Wakefield-Vette |
50
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 3X5X2.5" POWER/IGBT
|
395 | Board Level | 3.000" (76.20mm) | 5.000" (127.00mm) | Bolt On | Power Modules | - | 0.50°C/W @ 500 LFM | 1.10°C/W | ||
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|
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Wakefield-Vette |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 5.5X5X2.5" POWER/IGBT
|
395 | Board Level | 5.500" (139.70mm) | 5.000" (127.00mm) | Bolt On | Power Modules | - | 0.30°C/W @ 500 LFM | 0.90°C/W |
