- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Apex Microtechnology |
87
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO3
|
5.421" (139.70mm) | TO-3 | 0.40°C/W @ 800 LFM | 1.48°C/W | ||
|
|
|
Apex Microtechnology |
48
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 8P TO-3 1.7C/W
|
3.000" (76.20mm) | TO-3 | 1.00°C/W @ 200 LFM | 2.00°C/W | ||
|
|
|
Apex Microtechnology |
4
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 10P DIP
|
3.000" (76.20mm) | 10-PowerDip | 0.60°C/W @ 600 LFM | 2.00°C/W | ||
|
|
|
Apex Microtechnology |
4
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK OPEN FRAME
|
5.421" (139.70mm) | - | 0.40°C/W @ 800 LFM | 1.46°C/W |
