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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
2,632
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Square, Pin Fins | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | ||
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Apex Microtechnology |
422
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TOP MT TO-3
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Apex Precision Power | Rhombus | 1.000" (25.40mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 1.5W @ 20°C | 2.00°C/W @ 600 LFM | 11.60°C/W |
