- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
192
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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0.355" (9.02mm) | 6.80°C/W @ 400 LFM | 19.60°C/W | ||
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CTS Thermal Management Products |
661
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
0.555" (14.10mm) | 5.20°C/W @ 400 LFM | 16.50°C/W |
