- Series：
-
- Shape：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Condiciones seleccionadas:
Descubre los productos 10,376
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
4,845
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,953
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
- | Top Mount | Square, Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
222
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 7.5MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 8.60°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
3,361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25.4MM X 25.4MM X 4MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.157" (4.00mm) | 9.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
809
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 0.984" (25.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 3.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
Wakefield-Vette |
3,636
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
625 | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,151
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM L-TAB CP
|
pushPIN | Top Mount | Square, Fins | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 18.36°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
270
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Top Mount | Square, Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 8.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 8.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
511
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 17.5MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 3.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
ASSMANN WSW Components |
1,035
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Square, Fins | 0.984" (25.00mm) | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | 18.00°C/W | Tin | ||
|
|
Advanced Thermal Solutions Inc. |
124
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM R-TAB CP
|
pushPIN | Top Mount | Square, Fins | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 18.36°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,348
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM R-TAB FP
|
pushPIN | Top Mount | Square, Fins | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 28.85°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
350
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X20MM L-TAB FP
|
pushPIN | Top Mount | Square, Fins | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 15.02°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
148
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | Top Mount | Square, Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 4.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
170
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 4.70°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
560
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 0.984" (25.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 5.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,087
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
maxiGRIP | Top Mount | Square, Fins | 0.984" (25.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
Wakefield-Vette |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 SCREW
|
678 | Board Level, Vertical | Rectangular, Fins | 2.362" (60.00mm) | Bolt On and Board Mounts | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
903
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 W/CLIP
|
678 | Board Level, Vertical | Rectangular, Fins | 2.362" (60.00mm) | Clip, Solder Foot | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized |
