- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 12
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
4,845
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,636
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
625 | Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
|
|
Advanced Thermal Solutions Inc. |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Thermal Tape, Adhesive (Included) | 0.571" (14.50mm) | 8.80°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
170
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | Thermal Tape, Adhesive (Included) | 0.964" (24.50mm) | 4.70°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
58
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
- | Thermal Tape, Adhesive (Included) | 0.374" (9.50mm) | 16.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
22
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 19.5MM
|
- | Thermal Tape, Adhesive (Included) | 0.768" (19.50mm) | 6.20°C/W @ 200 LFM | |||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Adhesive | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X9.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | 0.374" (9.50mm) | 16.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X14.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | 0.571" (14.50mm) | 8.80°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X19.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | 0.768" (19.50mm) | 6.20°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
10
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X24.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | 0.964" (24.50mm) | 4.70°C/W @ 200 LFM | |||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM |
