- Material：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Condiciones seleccionadas:
Descubre los productos 10
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,455
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .25
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | 0.250" (6.35mm) | 16.00°C/W @ 200 LFM | 32.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
15,536
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,535
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 13MM
|
- | Board Level | Copper | 0.780" (19.81mm) | 0.520" (13.21mm) | Clip and PC Pin | 0.515" (13.08mm) | 8.00°C/W @ 500 LFM | 28.30°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
452
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .250" COMPACT
|
- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | 0.250" (6.35mm) | 10.00°C/W @ 500 LFM | 32.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Copper | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
|
|
|
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .50"H BLACK TO-220
|
7 | Board Level | Aluminum | 0.710" (18.03mm) | 1.000" (25.40mm) | Bolt On | 0.500" (12.70mm) | - | 33.90°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .187"H BLK TO-220
|
7 | Board Level | Aluminum | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On and PC Pin | 0.187" (4.75mm) | - | 33.90°C/W | Black Anodized | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 6.4X13.2X19.1MM
|
- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | 0.250" (6.35mm) | 10.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 6.4X13.3X19.1MM
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | 0.250" (6.35mm) | 16.00°C/W @ 200 LFM | - | Black Anodized |
