Fabricante:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HS21
Apex Microtechnology
2
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 6P DIP
Apex Precision Power 6-DIP 0.900" (22.86mm) 3.0W @ 20°C 30.00°C/W @ 500 LFM 5.60°C/W
500503B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-3 14W H=0.82" BLK
- TO-3 0.821" (20.86mm) 6.0W @ 40°C 2.00°C/W @ 500 LFM 4.90°C/W
HP1-TO3-CB
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK PWR .90"H BLACK TO-3
HP1 TO-3 0.900" (22.86mm) - - 5.40°C/W