- Type：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
166
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 56MM X 56MM X 31MM
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Top Mount | Square, Angled Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | Push Pin | LGA | - | 1.00°C/W @ 200 LFM | - | |||
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Advanced Thermal Solutions Inc. |
843
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 BLACK
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Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | - | 2.60°C/W @ 200 LFM | 6.00°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Rectangular, Fins | 0.602" (15.29mm) | - | Press Fit | TO-92 | 0.5W @ 20°C | 20.00°C/W @ 200 LFM | 40.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.60°C/W |
