- Series：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 48
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
17,584
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Square, Pin Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
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Wakefield-Vette |
5,813
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/ADH BLK
|
624 | Square, Pin Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
301
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X23MM PIN
|
902 | Square, Pin Fins | 0.827" (21.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 4.30°C/W @ 200 LFM | 11.60°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
193
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 0.3W @ 20°C | 20.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
212
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 11.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,076
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 19.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 8.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
Wakefield-Vette |
335
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X12MM PIN
|
902 | Square, Pin Fins | 0.827" (21.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 5.80°C/W @ 200 LFM | 14.30°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
488
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 12.5MM
|
maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 7.20°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
115
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 17.5MM
|
maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 5.40°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
434
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 19.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
419
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 21X21X17.5MM
|
maxiFLOW, superGRIP | Square, Angled Fins | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 5.40°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
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Wakefield-Vette |
269
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X12MM ELLIPTICAL
|
902 | Square, Fins | 0.827" (21.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 6.60°C/W @ 200 LFM | 12.40°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
128
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 21.90°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
156
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 7.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 11.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
992
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 14.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 0.3W @ 20°C | 11.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
363
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 14.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,597
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 19.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 0.3W @ 20°C | 7.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
2,542
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 14.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 7.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 24.5MM
|
- | Square, Fins | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 0.3W @ 20°C | 6.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
59
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 19.5MM
|
maxiGRIP | Square, Fins | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 7.80°C/W @ 200 LFM | - | Black Anodized |
