- Series:
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- Type:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 6
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Wakefield-Vette |
900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 128PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .750"H BLK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | Bolt On | TO-220 | 0.750" (19.05mm) | 2.5W @ 40°C | - | 20.00°C/W | Black Anodized |