Fabricante:
Series:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Shape Length Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
D10850-40
Wakefield-Vette
900
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 128PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.850" (21.59mm) Thermal Tape, Adhesive (Not Included) BGA 0.400" (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - -
D10850-40T1E
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 128PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.850" (21.59mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - -
D10850-40T3
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 128PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.850" (21.59mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - -
D10850-40T5
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 128PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.850" (21.59mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - -
D10850-40T4E
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 128PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.850" (21.59mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - -
7-370-BA
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK VERT .750"H BLK TO-220
7 Board Level Aluminum Rectangular, Fins 1.000" (25.40mm) Bolt On TO-220 0.750" (19.05mm) 2.5W @ 40°C - 20.00°C/W Black Anodized