- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 12
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
1,900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 5.30°C/W @ 200 LFM | - | ||
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|
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CTS Thermal Management Products |
969
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
371
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 5.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
1,356
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
438
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | - | ||
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Advanced Thermal Solutions Inc. |
1,857
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-126 BLACK
|
- | Board Level | Rectangular, Fins | 0.560" (14.22mm) | 0.620" (15.75mm) | Bolt On | TO-126 | - | 19.00°C/W @ 200 LFM | 33.00°C/W | |||
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|
|
CUI Inc. |
1,434
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 6.5W ALUMINUM
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- | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 6.5W @ 75°C | 3.76°C/W @ 200 LFM | 11.54°C/W | ||
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|
|
CTS Thermal Management Products |
80
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | - | ||
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ASSMANN WSW Components |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK BLK ALUM TO-220 DUAL
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- | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 (Dual) | - | - | 7.00°C/W | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | Bolt On and PC Pin | TO-220 | 2.0W @ 30°C | - | - | ||
|
|
|
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 0.054" (1.38mm) | Bolt On and PC Pin | TO-220 | 2.0W @ 30°C | - | - | ||
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Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 36.8X44.5X9.4MM
|
- | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | - |
