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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
16,283
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3 dias |
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 18.00°C/W | Tin | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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Board Level | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | - | Black Anodized |
