Fabricante:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
577202B00000G
Aavid, Thermal Division of Boyd Corporation
17,317
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK TO-220 .500" COMPACT
Board Level Bolt On 1.5W @ 40°C 10.00°C/W @ 200 LFM
577202B04000G
Aavid, Thermal Division of Boyd Corporation
6,180
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 .500" COMPACT
Board Level, Vertical Bolt On and PC Pin 1.5W @ 40°C 10.00°C/W @ 200 LFM
ATS-PCB1013
Advanced Thermal Solutions Inc.
1,749
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MNT W/TAB
Board Level, Vertical Bolt On and PC Pin - 9.50°C/W @ 200 LFM
ATS-PCB1014
Advanced Thermal Solutions Inc.
1,945
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLACK 6-32NUT
Board Level Bolt On - 9.50°C/W @ 200 LFM
ATS-PCB1072
Advanced Thermal Solutions Inc.
1,701
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLACK
Board Level Bolt On - 9.50°C/W @ 200 LFM