- Type：
-
- Shape：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
CTS Thermal Management Products |
661
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 16.50°C/W | ||
|
|
|
Wakefield-Vette |
1,546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR STUD MT DIODE BLACK
|
695 | Board Level | - | - | - | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Bolt On | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 18.00°C/W |
