- Series：
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- Material：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 8
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
4,209
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X25.4MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 2.5W @ 50°C | 3.00°C/W @ 700 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X50.8MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 1.5W @ 20°C | 2.00°C/W @ 800 LFM | Black Anodized | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X38.1MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 1.0W @ 20°C | 5.00°C/W @ 200 LFM | Black Anodized |
