- Type:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
18,047
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16 DIP BLACK .19"
|
- | Top Mount | Rectangular, Fins | 0.731" (18.57mm) | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
793
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Rectangular, Fins | 0.748" (19.00mm) | Press Fit | 14-DIP and 16-DIP | 0.190" (4.83mm) | - | - | 48.00°C/W | Black Anodized | ||||
Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
.5X.25X.34 HEATSINK FOR DIODE
|
258 | Board Level | Rectangular | 0.500" (12.70mm) | Type 120 Compound | Stud Mounted Diode | 0.340" (8.64mm) | - | - | 12.00°C/W | - |