- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Wakefield-Vette |
4,845
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | Black Anodized | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 13.1X13.2X24MM
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 0.5W @ 20°C | Tin |
