- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
134
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X23MM PIN
|
908 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
168
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X23MM ELLIPTICAL
|
908 | Top Mount | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | ||
|
|
|
ASSMANN WSW Components |
106
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Rectangular, Fins | 1.575" (40.01mm) | 0.748" (19.00mm) | Bolt On and PC Pin | SOT-32, TO-220 | 0.844" (21.44mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.400" (10.16mm) | 6.0W @ 60°C | 6.00°C/W @ 400 LFM |
