- Type：
-
- Material：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 80X80X12MM
|
Top Mount | Copper | Square, Fins | 3.150" (80.00mm) | 3.150" (80.00mm) | Push Pin | BGA | 0.472" (12.00mm) | - | 1.20°C/W @ 200 LFM | AavSHIELD 3C | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 1.50°C/W @ 600 LFM | Black Anodized |
