- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 58
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
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CUI Inc. |
1,467
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 5.5W @ 75°C | 4.44°C/W @ 200 LFM | 13.64°C/W | ||
|
|
|
CUI Inc. |
1,469
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | ||
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|
|
CUI Inc. |
1,383
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | ||
|
|
|
CUI Inc. |
1,016
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220,25.
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.8W @ 75°C | 3.28°C/W @ 200 LFM | 12.93°C/W | ||
|
|
|
CUI Inc. |
1,123
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.772" (45.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 6.4W @ 75°C | 3.86°C/W @ 200 LFM | 11.72°C/W | ||
|
|
|
CUI Inc. |
1,061
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
Board Level, Vertical | Rectangular, Fins | 1.969" (50.00mm) | 1.181" (30.00mm) | PC Pin | TO-220 | 0.472" (12.00mm) | 7.7W @ 75°C | 4.05°C/W @ 200 LFM | 9.74°C/W | ||
|
|
|
CUI Inc. |
1,195
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W | ||
|
|
|
CUI Inc. |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level | Rectangular | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 0.354" (9.00mm) | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | ||
|
|
|
CUI Inc. |
382
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 5.0W @ 75°C | 4.28°C/W @ 200 LFM | 15.00°C/W | ||
|
|
|
CUI Inc. |
934
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220/TO-
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 0.650" (16.50mm) | PC Pin | TO-218, TO-220 | 0.630" (16.00mm) | 4.7W @ 75°C | 4.93°C/W @ 200 LFM | 15.96°C/W | ||
|
|
|
CUI Inc. |
626
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 1.000" (25.40mm) | 8.0W @ 75°C | 3.26°C/W @ 200 LFM | 9.38°C/W | ||
|
|
|
CUI Inc. |
424
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.260" (32.00mm) | PC Pin | TO-220 | 0.551" (14.00mm) | 5.7W @ 75°C | 7.74°C/W @ 200 LFM | 13.16°C/W | ||
|
|
|
CUI Inc. |
746
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 0.984" (25.00mm) | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | ||
|
|
|
CUI Inc. |
748
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-218, 25
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | TO-218 | 0.984" (25.00mm) | 10.0W @ 75°C | 4.03°C/W @ 200 LFM | 7.50°C/W | ||
|
|
|
CUI Inc. |
592
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION,TO-218, 25.
|
Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.654" (42.00mm) | PC Pin | TO-218 | 0.984" (25.00mm) | 8.2W @ 75°C | 2.29°C/W @ 200 LFM | 9.15°C/W | ||
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|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 0.354" (9.00mm) | 3.7W @ 75°C | 6.84°C/W @ 200 LFM | 20.27°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 0.354" (9.00mm) | 3.1W @ 75°C | 7.07°C/W @ 200 LFM | 24.19°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 35
|
Board Level | Rectangular, Fins | 1.378" (35.00mm) | 1.142" (29.00mm) | Bolt On | TO-220 | 0.472" (12.00mm) | 6.2W @ 75°C | 2.91°C/W @ 200 LFM | 12.10°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 27
|
Board Level, Vertical | Rectangular, Fins | 1.063" (27.00mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 6.0W @ 75°C | 3.64°C/W @ 200 LFM | 12.50°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
Board Level, Vertical | Rectangular, Fins | 1.496" (38.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 7.3W @ 75°C | 5.77°C/W @ 200 LFM | 10.27°C/W |
