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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
355
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB/CLIP-ON
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Board Level, Vertical | Rectangular, Fins | 1.102" (28.00mm) | Clip and PC Pin | TO-220 | 0.787" (19.99mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 13.10°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square | 0.790" (20.07mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - |
