- Type：
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- Shape：
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- Length：
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- Width：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 9
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
156
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 56MM X 56MM X 52MM
|
Top Mount | Square, Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | Push Pin | 2.047" (52.00mm) | 0.51°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
166
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 56MM X 56MM X 31MM
|
Top Mount | Square, Angled Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | Push Pin | 1.220" (31.00mm) | 1.00°C/W @ 200 LFM | - | Black Anodized | |||
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Delta Electronics |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY LGA2011 NARROW
|
Board Level | Rectangular, Fins | 4.173" (106.00mm) | 2.756" (70.00mm) | Bolt On | 1.004" (25.50mm) | - | 0.26°C/W | - | ||
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|
Delta Electronics |
12
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL NEHALEM 1366
|
Board Level | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | Bolt On | 1.004" (25.50mm) | - | 0.26°C/W | - | ||
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|
|
Delta Electronics |
28
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL LGA2011
|
Board Level | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | Bolt On | 1.004" (25.50mm) | - | 0.24°C/W | - | ||
|
|
Advanced Thermal Solutions Inc. |
45
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 94MM X 94MM X 27MM
|
Top Mount | Square, Fins | 3.700" (94.00mm) | 3.700" (93.98mm) | Push Pin | 1.063" (27.00mm) | 1.40°C/W @ 200 LFM | - | Black Anodized | |||
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|
|
Delta Electronics |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL LGA2011
|
Board Level | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | Bolt On | 2.519" (64.00mm) | - | 0.17°C/W | - | ||
|
|
Advanced Thermal Solutions Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 94MM X 101MM X 27MM
|
Top Mount | Rectangular, Angled Fins | 3.700" (94.00mm) | 3.980" (101.00mm) | Push Pin | 1.063" (27.00mm) | 1.00°C/W @ 200 LFM | - | Black Anodized | |||
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Delta Electronics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA1366
|
Board Level | Square | 3.543" (90.00mm) | 3.543" (90.00mm) | Bolt On | 1.004" (25.50mm) | - | 0.27°C/W | - |
